In vitro measurement of the mechanical properties of skin by nano/microindentation methods T Jee, K Komvopoulos Journal of biomechanics 47 (5), 1186-1192, 2014 | 33 | 2014 |
Skin viscoelasticity studied in vitro by microprobe-based techniques T Jee, K Komvopoulos Journal of Biomechanics 47 (2), 553-559, 2014 | 19 | 2014 |
Effect of microstructures of PVDF on surface adhesive forces T Jee, H Lee, B Mika, H Liang Tribology Letters 26, 125-130, 2007 | 19 | 2007 |
Co-optimization of lithographic and patterning processes for improved EPE performance MJ Maslow, V Timoshkov, T Kiers, TK Jee, P de Loijer, S Morikita, ... Advanced Etch Technology for Nanopatterning VI 10149, 59-74, 2017 | 14 | 2017 |
In vitro investigation of skin damage due to microscale shearing T Jee, K Komvopoulos Journal of Biomedical Materials Research Part A 102 (11), 4078-4086, 2014 | 9 | 2014 |
EUV local CDU healing performance and modeling capability towards 5nm node TK Jee, V Timoshkov, P Choi, D Rio, YC Tsai, H Yaegashi, K Koike, ... International Conference on Extreme Ultraviolet Lithography 2017 10450, 182-190, 2017 | 5 | 2017 |
Nanoscale characterization of solution-cast poly (vinylidene fluoride) thinfilms using atomic force microscopy TK Jee Texas A&M University, 2007 | 5 | 2007 |
Evaluation of robust EPE monitoring and control metric methodologies for advanced DRAM nodes yield improvement Y Abramovitz, JH Yeo, T Jee, HG Lee, SH Lee, CH Park Metrology, Inspection, and Process Control XXXVI, PC120530N, 2022 | 4 | 2022 |
Edge placement error wafer mapping and investigation for improvement in advanced DRAM node KM Chen, W Henke, JH Jung, E Kasperkiewicz, A Bouma, R Rahman, ... Metrology, Inspection, and Process Control for Semiconductor Manufacturing …, 2021 | 4 | 2021 |
Atomic Force Microscopic Study of Piezoelectric Polymers H Lee, K Wang, T Jee, H Liang Applied Scanning Probe Methods XIII: Biomimetics and Industrial Applications …, 2009 | 4 | 2009 |
EUV via hole pattern fidelity enhancement through novel resist and post-litho plasma treatment H Yaegashi, K Koike, C Fonseca, F Yamashita, K Kaushik, S Morikita, ... Advances in Patterning Materials and Processes XXXV 10586, 1058605, 2018 | 3 | 2018 |
Co-optimization of exposure dose and etch process for SAQP pitch walk control MJ Maslow, V Timoshkov, T Kiers, TK Jee, L Reijnen, K Kumar, ... Optical Microlithography XXXI 10587, 11-24, 2018 | 2 | 2018 |
Budgeting and predicting pattern defects using edge placement error and machine learning T Jee, J You, HG Lee, SH Lee, S Hong, J Seo, R Meir, N Oved, J Park, ... 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 1-4, 2023 | 1 | 2023 |
Mechanical and Tribological Properties of Skin Studied by Microscale Indentation and Scratching Techniques T Jee UC Berkeley, 2013 | 1 | 2013 |
Damage of Micropatterned Surfaces Due to Bubble Cavitation-Erosion T Jee, K Komvopoulos International Joint Tribology Conference 44199, 33-35, 2010 | 1 | 2010 |
Effects of microstructures of PVDF on surface adhesive forces T Jee, H Lee, B Mika, S Mani, H Liang International Joint Tribology Conference 42592, 1015-1020, 2006 | 1 | 2006 |
Real time EPE measurement as a yield correlated metrology on advanced DRAM nodes T Jee, J You, HG Lee, S Hong, J Cho, T Lee, J Seo, M Shifrin, R Porat, ... Metrology, Inspection, and Process Control XXXVIII 12955, 146-153, 2024 | | 2024 |
Large field of view metrology: detecting critical edge placement error signatures not seen with small field of view in an HVM environment M Ridane, I Chen, J Song, P Nikolsky, KM Chen, S Lee, S Park, K Lin, ... Metrology, Inspection, and Process Control XXXVII 12496, 879-885, 2023 | | 2023 |
Surface Damage of Thin-Film Patterned Electrodes Due to Bubble Collapse T Jee, SH Yoon, K Komvopoulos Nanoscience and Nanotechnology Letters 6 (11), 971-975, 2014 | | 2014 |