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- Zhenan BaoStanford UniversityVerified email at stanford.edu
- Bernhard BoserUC BerkeleyVerified email at eecs.berkeley.edu
- Francisco Molina-LopezAssociate Professor KU LeuvenVerified email at kuleuven.be
- Thomas KennyProfessor of Mechanical Engineering, Stanford UniversityVerified email at cdr.stanford.edu
- Daniel BankmanAnalog IC Designer, AppleVerified email at apple.com
- Shan X. WangStanford UniversityVerified email at stanford.edu
- Matthew A HopcroftGeorge Washington, Cambridge, Stanford, Berkeley, Hewlett-PackardVerified email at mems.stanford.edu
- Lita YangStanford UniversityVerified email at alumni.stanford.edu
- Rob CandlerUniversity of California, Los AngelesVerified email at g.ucla.edu
- Bongsang KimInvensenseVerified email at invensense.com
- Manar El-ChammasVerified email at el-chammas.com
- Richard GasterStanford UniversityVerified email at alumni.stanford.edu
- Drew A. HallProfessor, University of California, San DiegoVerified email at ucsd.edu
- Jong Won ChungSamsung Advanced Institue of TechnologyVerified email at samsung.com
- Marian VerhelstMicas - ESAT - KU Leuven, BelgiumVerified email at esat.kuleuven.be
- Saurabh ChandorkarAssistant ProfessorVerified email at iisc.ac.in
- Dante Gabriel MuratoreAssistant Professor, Delft University of TechnologyVerified email at tudelft.nl
- Ross WalkerAssociate Prof. at University of UtahVerified email at utah.edu
- Kofi MakinwaProfessor, Delft University of TechnologyVerified email at tudelft.nl
- Raphael PfattnerMaterials Science Institute of Barcelona, Spanish National Research Council (ICMAB-CSIC)Verified email at icmab.es