Metallic photonic crystal absorber‐emitter for efficient spectral control in high‐temperature solar thermophotovoltaics V Rinnerbauer, A Lenert, DM Bierman, YX Yeng, WR Chan, RD Geil, ... Advanced Energy Materials 4 (12), 1400334, 2014 | 310 | 2014 |
Toward high-energy-density, high-efficiency, and moderate-temperature chip-scale thermophotovoltaics WR Chan, P Bermel, RCN Pilawa-Podgurski, CH Marton, KF Jensen, ... Proceedings of the National Academy of Sciences 110 (14), 5309-5314, 2013 | 221 | 2013 |
High-temperature stability and selective thermal emission of polycrystalline tantalum photonic crystals V Rinnerbauer, YX Yeng, WR Chan, JJ Senkevich, JD Joannopoulos, ... Optics express 21 (9), 11482-11491, 2013 | 211 | 2013 |
Recent developments in high-temperature photonic crystals for energy conversion V Rinnerbauer, S Ndao, YX Yeng, WR Chan, JJ Senkevich, ... Energy & Environmental Science 5 (10), 8815-8823, 2012 | 179 | 2012 |
Large-area fabrication of high aspect ratio tantalum photonic crystals for high-temperature selective emitters V Rinnerbauer, S Ndao, Y Xiang Yeng, JJ Senkevich, KF Jensen, ... Journal of Vacuum Science & Technology B 31 (1), 2013 | 122 | 2013 |
Substrate‐Independent Palladium Atomic Layer Deposition JJ Senkevich, F Tang, D Rogers, JT Drotar, C Jezewski, WA Lanford, ... Chemical Vapor Deposition 9 (5), 258-264, 2003 | 99 | 2003 |
High-temperature tantalum tungsten alloy photonic crystals: Stability, optical properties, and fabrication V Stelmakh, V Rinnerbauer, RD Geil, PR Aimone, JJ Senkevich, ... Applied Physics Letters 103 (12), 2013 | 97 | 2013 |
Stress reduction in tungsten films using nanostructured compliant layers T Karabacak, CR Picu, JJ Senkevich, GC Wang, TM Lu Journal of Applied Physics 96 (10), 5740-5746, 2004 | 95 | 2004 |
Plasma‐assisted atomic layer deposition of palladium GA Ten Eyck, JJ Senkevich, F Tang, D Liu, S Pimanpang, T Karaback, ... Chemical Vapor Deposition 11 (1), 60-66, 2005 | 94 | 2005 |
Low temperature chemical vapor deposition of Co thin films from Co2 (CO) 8 DX Ye, S Pimanpang, C Jezewski, F Tang, JJ Senkevich, GC Wang, ... Thin Solid Films 485 (1-2), 95-100, 2005 | 83 | 2005 |
Surface chemistry of mercaptan and growth of pyridine short-chain alkoxy silane molecular layers JJ Senkevich, CJ Mitchell, GR Yang, TM Lu Langmuir 18 (5), 1587-1594, 2002 | 72 | 2002 |
Stress reduction in sputter deposited films using nanostructured compliant layers by high working-gas pressures T Karabacak, J Senkevich, GC Wang, TM Lu Journal of Vacuum Science & Technology A 23 (4), 986-990, 2005 | 67 | 2005 |
Inductively coupled hydrogen plasma-assisted Cu ALD on metallic and dielectric surfaces C Jezewski, WA Lanford, CJ Wiegand, JP Singh, PI Wang, JJ Senkevich, ... Journal of the Electrochemical Society 152 (2), C60, 2005 | 65 | 2005 |
Morphology of poly (chloro-p-xylylene) CVD thin films JJ Senkevich, SB Desu Polymer 40 (21), 5751-5759, 1999 | 63 | 1999 |
Direct copper electroless deposition on a tungsten barrier layer for ultralarge scale integration Y Kim, D Bae, H Yang, H Shin, GW Wang, JJ Senkevich, TM Lu Journal of the Electrochemical society 152 (2), C89, 2005 | 61 | 2005 |
Temperature studies of optical birefringence and X-ray diffraction with poly (p-xylylene), poly (chloro-p-xylylene) and poly (tetrafluoro-p-xylylene) CVD thin films JJ Senkevich, SB Desu, V Simkovic Polymer 41 (7), 2379-2390, 2000 | 60 | 2000 |
Poly (tetraflouro-p-xylylene), a low dielectric constant chemical vapor polymerized polymer JJ Senkevich, SB Desu Applied physics letters 72 (2), 258-260, 1998 | 59 | 1998 |
The facile surface modification of poly (p-xylylene) ultrathin films JJ Senkevich, GR Yang, TM Lu Colloids and Surfaces A: Physicochemical and Engineering Aspects 216 (1-3 …, 2003 | 57* | 2003 |
Atomic layer deposition of noble metals J Senkevich, TM Lu US Patent App. 10/531,245, 2006 | 50 | 2006 |
Effect of hydrophilic group on water droplet contact angles on surfaces of acid modified SiLK and Parylene polymers S Pimanpang, PI Wang, JJ Senkevich, GC Wang, TM Lu Colloids and Surfaces A: Physicochemical and Engineering Aspects 278 (1-3 …, 2006 | 44 | 2006 |