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Co-authors
- Chando ParkQualcomm, carnegie Mellon university, western digitalVerified email at amat.com
- Matthias GottwaldIBM - TJ Watson Research CenterVerified email at us.ibm.com
- Dylan LuUniversity of California, Berkeley, LBNL, & UCSDVerified email at berkeley.edu
- Peiyuan WangQualcommVerified email at qti.qualcomm.com
- Jaesoo AhnApplied MaterialsVerified email at alumni.stanford.edu
- Nasim EibagiWestern DigitalVerified email at wdc.com
- Vojtěch UhlířCentral European Institute of Technology, Brno University of TechnologyVerified email at ceitec.vutbr.cz
- Lin XueSenior Process Engineer, Applied MaterialsVerified email at cornell.edu
- Peter FischerSenior Scientist LBNL | Adjunct Professor Physics UC Santa Cruz | APS Fellow | IEEE FellowVerified email at lbl.gov
- Michal UrbánekBrno University of TechnologyVerified email at ceitec.vutbr.cz
- Weisheng ZhaoFert Beijing Institute, Beihang UniversityVerified email at buaa.edu.cn
- Jian-Ping WangDistinguished McKnight University Professor and Robert Hartmann Chair, University of MinnesotaVerified email at umn.edu
- Yuan XieChair Professor of Hong Kong University of Science and Technology (HKUST)Verified email at ust.hk
- Christopher DoranUniversity of California, San DiegoVerified email at ucsd.edu
- Mi-Young IMStaff Scientist, Lawrence Berkeley National LaboratoryVerified email at lbl.gov