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Co-authors
- Kaan OguzSenior Research Engineer, Components Research, IntelVerified email at tcd.ie
- Kevin P. O'BrienPrincipal Research Engineer, Intel Corp - Components ResearchVerified email at intel.com
- T. GhaniIntel Senior FellowVerified email at intel.com
- Justin BrockmanAppleVerified email at Apple.com
- Angeline Klemm SmithUniversity of MinnesotaVerified email at umn.edu
- Tanay GosaviKepler | Intel | CornellVerified email at keplercompute.com
- Ian A YoungIntel CorporationVerified email at intel.com
- Sasi ManipatruniKepler/Intel/CornellVerified email at cornell.edu
- Jay SenkevichMassachusetts Institute of TechnologyVerified email at mit.edu
- Toh-Ming LuRensselaer Polytechnic InstituteVerified email at rpi.edu
- Noriyuki SatoStanford UniversityVerified email at stanford.edu
- Srijit MukherjeeModule & Integr Yield Eng, Portland Technology Develop, IntelVerified email at intel.com
- Stephen RameyIntelVerified email at intel.com
- Juan G AlzateApple/Intel/UCLA/UniAndesVerified email at apple.com
- William A LanfordProfessor of Physics, University at Albany SUNYVerified email at albany.edu
- Pedro Alejandro QuinteroIntelVerified email at intel.com
- Anupama MallikarjunanVersum MaterialsVerified email at versummaterials.com
- Anisur RahmanMicrosoft CorpVerified email at microsoft.com
- Leonard InterranteProfessor Emeritus - ChemistryVerified email at rpi.edu
- Dan BergstromIntel CorporationVerified email at intel.com